Apex Conference: What Was Published

For those who missed last week’s Apex/Expo conference (which is almost all of you), here’s a look at the technical conference:

IPC Printed Circuits Apex Expo 2010

Production of Flexible Circuits in Reel-to-Reel Horizontal Production Systems — Stephan Kenny, Atotech

A New System for Automatically Registering and Exposing Solder Mask and Other Photopolymeric Materials Requiring High Energy Lamp Sources — Lionel Fullwood, WKK Distribution Ltd.

Toughened Laminates for Printed Circuit Boards: Correlation of Drillability to Material Properties — Lameck Banda, Dow Chemical

Lead-free Flux Technology and Influence on Cleaning — Ning-Cheng Lee, Indium

Selecting Cleaning Processes for Electronics Defluxing: Total Cost of Ownership — Mike Savidakis,Petroferm

Validity of the IPC R.O.S.E. Method 2.3.25 Researched — Mike Bixenman, D.B.A., Kyzen Corporation

The Use of Inkjet Printing Technology for Fabricating Electronic Circuits: The Promise and the Practical — Thomas Sutter, Dow Electronic Materials

Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR — Arnaud Grivon, Thales Corporate Services, France

A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit — Minsu (Tim) Lee,, Doosan Corp. Electro-Materials BG, South Korea

PCB Design and Assembly for Flip-Chip and Die Size — Vern Solberg, STC-Madison

The Universal PCB Design Grid System — Tom Hausherr, Valor Computerized Systems

A Strategy for Via Connections in Embedded Sheet Capacitance Design — J. Lee Parker, JLP

Lead-Free Acceleration Factors: Overview, Testing and Validation — Jean-Paul Clech, Ph.D., EPSI

Solder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation — Werner Engelmaier, Engelmaier Associates

Nanotechnology for Lead-Free PWB Final Finishes with Organic Metal — Jim Kenny, Enthone Cookson

Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards — David Lee, Johns Hopkins University

Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process — Tafadzwa Magaya, Atotech Deutschland, Germany

OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters . Mike Bixenman, D.B.A., Kyzen

Case Study – “Limitations of DI-Water Cleaning Processes” Umut Tosun, ZESTRON America

Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies — Beverley Christian, RIM

Robust Automated Void Detection in Solder Balls and Joints — Bonnie Bennett, Intel Corporation

Advances in Automatic Monitoring of Stencil Printing Processes — Dick Johnson, DEK International

Zoom Fixtures for ATE — Gary St. Onge, Everett Charles Technologies

Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component Rework/Repair — David Hillman, Rockwell Collins Douglas Pauls, Rockwell Collins

NASA-DoD Lead-Free Electronics Project: Mechanical Shock Test — Thomas Woodrow, Ph.D., Boeing

Copper Tin Intermetallic Crystals and Their Role in the Formation of Microbridges Between the Leads of Hand-Reworked Fine-Pitch Components — Jeff Kukelhan, BAE

The Challenges of Counterfeit Components — Hal Rotchadl, Premier Semiconductor Services

The Black Swan Effect in Military Applications — Jack Stradley, Rochester Electronics LLC

Conformal Coatings for Tin Whisker Risk Management — William Fox, Lockheed Martin Missiles & Fire Control

Effect of Soldering Method, Temperature, and Humidity on Whisker Growth in the Presence of Flux Residues — Keith Sweatman, Nihon Superior Co., Ltd., Japan

Bridging Supply Chain Gap for Exempt High-Reliability OEMs — Hal Rotchadl, Premier Semiconductor Services

Benefits and Limitations of Universal, Low Pin-Count Automated Test Equipment for Printed Circuit Assemblies — Heiko Ehrenberg, GOEPEL Electronics LLC

A Flexible Fixturing System for In-Circuit Test of High Node-Count Circuit Boards — Robert Jukna, Jabil

Effective Transition of Electronics Production Between Manufacturing Sites — Paul Novak, Delphi Corporation

Migrating from Paper to Interactive Paperless Work Instructions — John Stimadorakis, ScanCAD International, Inc.

Telecommunications Case Studies Address Head-In-Pillow (HNP) Defects and Mitigation through Assembly Process Modifications and Control — Russell Nowland, Alcatel-Lucent

Addressing the Challenge of Head-In-Pillow Defects in Electronics Assembly — Mario Scalzo, Indium Corporation

Thermal Effects on PCB Laminate Material Dielectric Constant and Dissipation Factor — Scott Hinaga, Cisco Systems, Inc.

Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties — Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD

Assessment of Moisture Content Measurement Methods for Printed Circuit Boards — Christopher Hunt, Ph.D., National Physical Laboratory, UK

Understanding SIR — Eric Bastow, Indium Corporation

Effects of Solder Mask on Electrochemical Migration of Tin-Lead and Lead-Free Boards — Xiaofei He, University of Maryland

Solder Paste Residue Corrosivity Assessment: Bono Test — Celine Puechagut, Inventec

Photochemical Machining (PCM) for Cost-effective, Rapid Production — David Allen, Cranfield University

Photochemical Machining and Photoetching: What Can It Do For You? — Mike Lynch, United Western Enterprises Inc.

Precision Parts Made by Photochemical Machining — Anthony Marrett, PrecisionMicro Ltd

Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly — Ning-Cheng Lee, Indium Corporation of America

PCB Assembly System Set-Up for PoP –Gerry Padnos, Juki Automation Systems

Embedded Packaging Technologies: Embedding Components to Meet Form, Fit, and Function — Casey Cooper, STI Electronics, Inc.

Printable Materials and Devices for Electronic Packaging — Rabindra Das, Endicott Interconnect Technologies, Inc.

Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency — George Kang, Arlon-MED

Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials — Bhanu Sood, Center for Advanced Life Cycle Engineering, UMD

Low Loss & Novel Halogen-Free Laminates for High-Frequency Device Applications — Anderson Cheng,, ITEQ Corporation

Determining Dielectric Properties of High Frequency PCB Laminate Materials — John Coonrod, Rogers Corporation

Design to Manufacturing Standards – What’s Now; What’s New, What’s Next? — Dieter Bergman, IPC

IPC/JEDEC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes — Fern Abrams, IPC, Jack McCullen, Intel, Lee Wilmot, TTM Technologies, Inc.

The Value of IPC-2152 — Michael Jouppi, Lockheed Martin Space Systems Company

IPC-2221, Keeping Pace with the Times — Gary Ferrari, FTG Circuits

Thermal Cycling Reliability Screening of Multiple Pb-free Solder Ball Alloys — Joe Smetana, Alcatel-Lucent

Achieving High-Reliability, Low-Cost Lead-Free SAC Solder Joints Via Mn Or Ce Doping — Ning-Cheng Lee, Indium Corporation of America

Low-Silver BGA Assembly Phase II-Reliability Assessment Fifth Report: Preliminary Thermal Cycling Results — Chrys Shea, Shea Engineering Services

Module Assembly Process Panel — Dongkai Shangguan,, Flextronics Corporate Technology Group

Module Assembly Material — Steven Greene, STR

Module Assembly Equipment — Patrick Hofer-Noser, 3S Industries AG

Module Assembly Standards — David Torp, IPC- Association Connecting Electronics Industries

Module Certification — Richard Bozicevich, TUV Rheinland Photovoltaic Testing Laboratory

Creep Corrosion of OSP and ImAg PWB Finishes — Chen Xu, Lucent Technologies

An Investigation into Hand Sanitizers and Hand Lotions and Potential Risks to High Performance Electronics — Douglas Pauls, Rockwell Collins

Relationship of Via Size and Cleanliness –Eric Camden, Foresite

Where are REACH SVHC in Electronic Products and Parts? — Walter Jager, Intertek

Round Robin Testing in Support of IPC J-STD-709 Combustion: Sample Preparation Methods for Ion Chromatography Analysis of Br and Cl — Javier Falcon,, Intel Corporation

Effect of Board Clamping System on Solder Paste Print Quality — Rita Mohanty,Speedline Technologies, Inc

Stencil Design Considerations to Improve Drop Test Performance — Jeff Schake, DEK USA Inc.

Fighting the Undesirable Effects of Thermal Cycling — Gabe Cherian, Cherian LLC

Comparative Analysis of Solder Joint Degradation Using RF Impedance and Event Detectors — Michael Azarian,, University of Maryland

Poor Metrology: The Hidden Cost — Michael Cieslinski, Panasonic Factory Solutions Company of America

Using DMAIC Methodology for MLP Reflow Process Optimization — Dennis Lang, Fairchild Semiconductor

Head-On-Pillow Defect – A Pain in the Neck or Head-On-Pillow — BGA Solder Defect Chris Oliphant, Research in Motion Ltd., Canada

A Novel Approach to Experimentally Create and Mitigate Head-in-Pillow Defects — Guhan Subbarayan, Cisco Systems, Inc.

Challenges Toward Implementing a Halogen-Free PCB Assembly Process — Chris Anglin, Indium Corporation of America

A Novel Halogen-Free Material for High Speed PCB — Minsu (Tim) Lee,, Doosan Corp. Electro-Materials BG, South Korea

Halogen-Free Flame Retardant Epoxy Resins — Edward Peters, Sabic Innovative Plastics

Stencil Options for Printing Solder Paste for 0.3 mm Pitch CSPs and 01005 Chip Components — William Coleman, Photo Stencil Inc.

Effect of Squeegee Blade on Solder Paste Print Quality — Rita Mohanty, Speedline Technologies, Inc

Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume — Chris Anglin, Indium

Drop Test Performance of Medium Complexity Lead-Free Board After Assembly and Rework — Jason Bragg, Celestica Inc.

Pad Cratering Evaluation of PCB — Dongji Xie, Flextronics International USA

Effect of Environmental Stress and Bias Conditions on Reliability of Embedded Planar Capacitors — Mohammed Alam, University of Maryland

Basic PCB Level Assembly Process Methodology for 3-D Package-on-Package — Vern Solberg, STC-Madison

Designing the PCB for Efficient Pop Underfill — Brad Perkins, Asymtek

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package-on-Packages under Torsion Loads
Vikram Srinivas, Center for Advance Life Cycle Engineering

Progress in Developing Industry Standard Test Requirements for Solder Alloys — Kristen Troxel, Hewlett-Packard Company

Characterizing the Lead-Free Impact on PCB Pad Craters — Brian Roggeman, Universal Instruments Corporation

Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes — Raiyomand Aspandiar, Intel Corporation and Robert Kinyanjui, Sanmina-SCI

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow

1 thought on “Apex Conference: What Was Published

  1. Would have liked to have been there but I’m chained to a desk in the UK. Now something similar to Virtual PCB would be great for those of us oversea’s.

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