January Issue Highlights

The January issue of of PRINTED CIRCUIT DESIGN & FAB and CIRCUITS ASSEMBLY is now available. Our cover story, from Skyworks, looks at
as-shipped vs. mounted height for BGA and LGA packages.

When a component is surface-mounted to the motherboard, the x- and y- dimensions do not change. Not so for the height. LGA height increases; BGA height decreases. A new study shows how an increase in as-shipped thickness can enable greater electrical performance and reduce quality risk.

This month’s other highlights include:

  • Understanding schematics
  • Using Maxwell’s equations to solve transmission line problems
  • Determining Df and Dk tradeoffs among various laminates
  • Bare board x-ray inspection
  • Busting the myth of PCB design at the college level
  • A profile of EMS firm Green Circuits
  • Ten steps for achieving good DfX
  • The latest happenings among the IPC Designers Council chapters
  • And Peter Bigelow asks if smaller manufacturers outmaneuvering the big ones.

Check it all out here.

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow