Let’s Get Small

With 005005 components (metric 0201)  scheduled for production within two years, it becomes less attractive to place and solder what are truly microminiature parts using traditional means.

Robert Barbucha, a researcher at the Institute of Fluid-Flow Machinery Center’s Plasma and Laser Engineering in Gda?sk, Poland, is working on a laser device that may solve the problem. His method involves using lasers to project pathways on printed circuit boards covered with a layer of photopolymer. The concept isn’t novel — many engineers have suggested printing or lasering parts on boards — but in this case the laser itself is the focus of Barbucha’s research. He reportedly has begun working with a manufacturer in Gda?sk to produce a prototype.

Stay tuned.

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow