New Rigid Design Spec Shows Flexibility

Lots of changes in the first revision of the industry rigid board design spec since it was introduced as a separate module in 1998.

IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards, is characterized by the addition of several tables intended to simplify design decisions, particularly when it comes to materials. New tables offer at-a-glance differences in dimensional stability, CTE, and material consistency, by laminate type.

PCB thickness tolerances, key in assessing potential bow and twist, have been clarified, as the measurement method has been standardized to include just laminate to laminate, with no coatings or platings included.

Another table aids the understanding of relative costs, but keep in mind that laminate pricing is subject to change. 

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow