Schweizer Electronic has filed for a patent for producing an embedded component multilayer circuit board, becoming approximately the 4,381st company to do so.
Just kidding.
Sort of.
Embedding actual components — actives or passives — has been a technology that not only was conceived (and patented) years ago, but has been in production for years in high-reliability (read: missile) technology.
The literature is full of articles explaining how to design, fabricate and test such boards and devices.
Yes, there are slightly different processes for achieving the end-result, but none such I am aware of that at this point would qualify as truly novel.
Here’s a thought. Instead of creating even more potential barriers to entry by muddying the IP waters even further for this important technology, let’s all call a truce and set out to help build what the OEMs want: cheaper, faster, lighter products.
Mike – As I and several others have learned (with significant expense I might add.) the mere ownership of a patent usually does little to block others from using methods or structures similar to what’s described in the patent.
Currently what the owner of a patent intends to do with it has a huge bearing on whether they have any real protection. Practicing Entities (PEs) and more protected than Non-practicing Entities (NPEs)
Additionally what the patent claims cover are the real key to what power they have.
To the defense of the small inventor, they do need incentive and protection. Especially in areas near and dear to our hearts, such as, pcb and IC packaging. With much of the production having been sent offshore to places who spend little to no money on R and D there needs to be some incentive for new development.
Phil
ISHM anyone?
all been done before….
Surprised so few are aware of Hybrid electronics.
Wasn’t clear if the Patent application was for a US patent or a German patent.
Another problem with IP protection .. only recognized with limited countries.
I believe it’s a German patent, John.