Tag Archives: 2015

The Top 10 in PCD&F

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Yesterday, we reported the top 10 best-read articles published by CIRCUITS ASSEMBLY in 2015. Today we list the best-read articles from PCD&F.

The list includes features that were published for the first time in calendar 2015. Rankings are based on web site hits, and do not include — for obvious reasons — the number of reads in the print version of the magazine.

1. “Embedded Passive Technology Materials, Design and Process,” by Hikmat Chammas
2. “Beyond the Vault: The Evolution of PCB Design Archiving,” by John McMillan.
3. “01005: Size Does Matter,” by Arbel Nissan.
4. “Trace Current/Temperature Relationships,” by Douglas G. Brooks, Ph.D. and Johannes Adam, Ph.D.
5. “Microsectioning of Laminates,” by Karin Rudman Prieto, Ph.D., Peg Conn, Lizabeth Lagos and Charles Lehmann.
6. “The Changing Face of the Hardware Design Engineer,” by Steve Hughes.
7. “Refining Lean NPI at Optimum Design Associates,” by Randy Holt.
8. “The 3 Challenges Facing the Future of PCB Design,” by David Wiens.
9. “How Hot Is My Via? (Cooler Than You Think!),” by Douglas G. Brooks, Ph.D. and Johannes Adam, Ph.D.
10. “In Search of Greater Tolerance,” by Peter Bigelow.

There was a definite advantage for articles that were published near the beginning of the year. If we adjust for timing, a feature on field solvers authored by Dr. Eric Bogatin and published just last month more than likely would have made the top 10. And although not reflected here, there was tremendous and perhaps disproportionate interest in flex circuits, given the smaller audience involved to-date in flex, with pieces by Mark Finstad (“Designing Flex Circuits For Wearable Electronics“) and Ben Jordan (“Designing a Successful High-Speed Rigid-Flex PCB“) just missing the top 10.

As always, we are grateful for our loyal readers and the many authors who contribute their expertise each month.

The Top 10 in CIRCUITS ASSEMBLY

Posted on by

For the past several years, we have taken a few moments at year-end to look back at the best-read articles of 2015.

The list includes features that were published for the first time in calendar 2015. Rankings are based on web site hits, and do not include — for obvious reasons — the number of reads in the print version of the magazine.

We’ll start today with the top 10 from CIRCUITS ASSEMBLY. Tomorrow we will list the best-read articles from PCD&F.

1. “How Clean is Clean Enough?” by Terry Munson, Paco Solis, Nick Munson, Steve Ring and Evan Briscoe

2. “01005: Size Does Matter,” by Arbel Nissan.

3. “Designing Flex Circuits For Wearable Electronics,” by Mark Finstad.

4. “Depaneling of Circuit Boards,” by Ahne Oosterhof and Thomas Nether.

5. “What You Cannot See Can Be Hand Soldered,” by Paul Wood and Bob Wettermann.

6. “A New SPI Tool for Defect Prevention,” by Chrys Shea.

7. “Zooming in on Digital Microscopes,” by Chrys Shea and Kristoffer Tømmergaard.

8. “China in Charge, by Dr. Hayao Nakahara.

9. “US or Mexico: Which Option Makes Most Sense for Your Project?” by Joe Villanueva.

10. “Cost/Benefit Tradeoffs of Capacitor Part Size vs. Manufacturing Efficiency,” by Chris Reynolds.

As you can see, a mix of technical and business-related pieces made up the top 10 this year. Interest was high in cutting-edge technology (multiple pieces on 01005s, wearable flex circuitry), but tutorial-type pieces on conventional technology held its own as well (cleaning, circuit board depaneling).

As always, we are grateful for our loyal readers and the many authors who contribute their expertise each month.