What a Waste

All sorts of nonsense is erupting in our industry’s corner of the environmental arena this past week. Let’s go to the tape:

  • On May 14, Rep. Michael Burgess (R-TX) introduced a bill that essentially codifies the EU RoHS Directive for the US as well. The bill proposes to prohibit the manufacture after July 1, 2010 of “electroindustry products” that contain lead, mercury, cadmium, hexavalent chromium, PBBs, and PBDEs above the maximum concentration levels specified in the European Union’s RoHS Directive.
  • Today, the Electronics TakeBack Coalition issued a statement opposing a toxic e-waste bill scheduled to be introduced in the House later this week. The bill, sponsored by Rep. Gene Green (D-TX) (how’s that for irony?), Rep. Mary Bono-Mack (R-CA) and Rep. Mike Thompson (D-CA), permits e-waste exports under a loophole under which any type of entity can export toxic e-waste to developing nations for reuse and refurbishment, the Coalition asserts.

    “By passing a law that only appears to restrict exports to developing countries without actually doing so, the bill would undermine those recycling companies which are in fact managing their e-waste responsibly, and providing jobs here at home. This bill fails in serious and even critical ways.”

  • And in between, IPC issued a press release boasting how 22 of its 2700-odd members managed to trek to Washington in support of a permanent R&D tax credit, something that just about every technology company operating in the US already supports anyway — and many of which are priming the lobbying pump to ensure it goes through.

    So in summary, we have a Republican from Texas trying to overlay (absurd) European laws onto US manufacturers, an industry environmental advocacy group trying to shoot down new proposed environmental regs, and the major US PCB trade association completely in the dark about all of it.

    Not too good.

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    About Mike

    Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow