I’ve been pretty occupied with the upcoming Embedded Systems Conference in Boston. The exhibition is next week on Tuesday and Wednesday, Sept. 21-22. Screaming Circuits will be in booth 809. Stop by if you happen to be at the show.
In any case, I’ve been pretty much wrapped up in show preparation so I haven’t had much time for original writing here. That being the case, I’m going to play an old TV sitcom trick and just select some old, but good, content to re-run.
- Here’s one about an, apparently controversial, usage for via-in-pad.
- Some handy tips related to using multiple thermally-large components.
- What to do if your QFN footprint somehow gets inverted and mirrored.
And, there you go.
Hide Wally Bee. Andre is back and he’s got a fly swatter