A Package Worth Gawking At

Here’s the new Xilinx part, which as contributing editor Jan Vardaman reports today, is the world’s first multi-die FPGA, with more than 3.5 times the logic capacity of the largest current-generation Xilinx 40 nm FPGA with serial transceivers and 2.8 times the logic capacity of the largest competing 28 nm FPGA with serial transceivers. Pretty cool stuff.

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow