B2it Expansion?

Old friend Dominique Numakura of DKN Research is reporting Dai Nippon Printing of Japan plans to expand manufacturing capacity of B2it motherboards in China 100 to 200% as part of a joint venture with Unimicron of Taiwan.

DNP holds a patent on B2it, a build-up printed circuit board fabrication process common in cellphones, digital cameras, and other handheld electronics.

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association (pcea.net). He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow