Board Buying Bonanza?

Here we go again?

DDi today proposed acquiring Coretec, a move that would close the gap between the California-based DDi and its quickturn rival, TTM Technologies.

It also marks the second potential M&A deal between “brand-name” board fabricators in the past four weeks. Earlier this month, Viasystems announced a pending acquisition of Merix.

Unlike the Via-Merix deal, while the impact wouldn’t be big in terms of the worldwide PWB fabricator rankings — likely boosting DDi from the low 60s to the top 50s in terms of size — it could change the pricing model for many board shops. DDi and Coretec have both invested heavily in HDI capability and have complementary markets (defense, telecom, quickturn/prototypes). It also would give the merged company a footprint in each of the continental US time zones. DDi had fiscal 2008 revenues of $190 million, while Coretec closed the year at C$81 million.

It strikes me that Coretec’s announcement late Friday that it would seek a cash infusion through the sale of 10 million shares of common stock was all the opening DDi needed to pull the trigger, especially given the relatively low market capitalization of Coretec.

This would be DDi’s first acquisition since its purchase of Sovereign Circuits in October 2006. DDi, of course, often made headlines in the last 1990s and 2000 as it bought company after company, building a PWB operation that once ranked among the top 20 worldwide. Simultaneously, Viasystems was doing much the same, only for both companies to hit the skids during the 2001-03 tech recession.

Today’s announcement makes sense, given the relatively cheap price DDi would have to pay to get Coretec. Whereas today’s headlines have certain echoes of 2000, it’s highly unlikely the risk of fallout is anywhere close.

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow