HDPUG’s New Head

The High Density Packaging User Group has named Larry Marcanti executive director, ending Marshall Andrews’ 15-year run as head of the trade consortium.

Larry is an excellent choice. He has a degree in chemical engineering, and has more than four decades’ experience in the printed circuit board industry with Honeywell, Nortel and Avaya, including the eight spent in various levels of involvement at HDPUG. He knows the industry needs inside and out, and will get things done.

But let’s give Marshall his deserved due. He is perhaps the most experienced technical consortia executive this industry ever had. From MCC to ITRI to HDPUG, Marshall had a hand in all the major nonprofit research groups affecting printed circuit boards and packaging.

Many folks step in and out of the trade group participation. Marshall was a lifer. His legacy will last for years.

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow