Did avoiding the voids just get less important?
A new study by Rockwell Collins, RIM, Indium and Dage shows voids are not a “primary” issue to BGA solder joint integrity.
New BGA voiding requirements to be proposed to J-STD-001 task group based on study’s findings, Rockwell engineer Dave Hillman says.
Interesting headline, is there any other information available in regard to this. The fact that ‘voids are not a primary issue’ suggests that there may be some other “new” findings?