Patents, Home and Abroad

The annual review of the world’s patent filings always tells an interesting story.

Some 2.9 million applications were filed in 2015, up 7.8% year-over-year. China led with 1.01 million filings, followed by the US (526,000) and Japan (454,000), reports the World Intellectual Property Organization.

But … (when it comes to China there’s always a big but) … only 4% of China’s applications were outside their own borders, while 45% of US applications were filed abroad.

Computer technology (7.9% of the total) saw the highest percentage of published patent applications worldwide, followed by electrical machinery (7.3%) and digital communication (4.9%), WIPO reports.

WIPO doesn’t indicate why Chinese inventors are by and large choosing only to protect their claims in-country. Here are some possible reasons:

1. The US requires that inventors obtain a “foreign filing license” before filing foreign patent applications on inventions that occur in the US.  “This allows the government to assess, for example, whether the technology could threaten US national security,” says Dennis Crouch, a professor at the University of Missouri School of Law and co-director of the Center for Intellectual Property and Entrepreneurship.

2. China, on the other hand, requires inventors to first file domestically, where it will then determine whether the invention needs to remain secret for security or other purposes. Only then is the inventor allowed to submit an application abroad.

In summary, domestic firewalls in the world’s two largest markets could well be hampering outsiders.

This entry was posted in Hot Wires and tagged , , by Mike. Bookmark the permalink.

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow