The Top 10 of 2016 — PCD&F

As we did with CIRCUITS ASSEMBLY, each year we review the 10 most-viewed features.

Keep in mind that the counts are not adjusted by the date of publication. Therefore, an article published in January has an advantage over one published in December. The month of publication is listed in parentheses.

10. “Designing PCBs for DDR Busses,” by Nitin Bhagwath (June 2016)

9. “Ensuring Reliable Products with New Rigid-Flex Design Rules,” by Jim Frey (September 2016)

8. “Empirical Confirmation of Via Temperatures,” by Doug Brooks, Ph.D. (February 2016)

7. “6 Pillars of PCB DfMA Success,” by John McMillan (March 2016)

6. “Insertion Loss Modeling,” by Jeff Loyer (January 2016)

5. “Price vs. Function in Today’s EDA Software,” by Chelsey Drysdale (December 2016)

4. “IPC-1782: The New Dawn of Electronics Traceability,” by Michael Ford (December 2016)

3. “5 Common Mistakes in Board Design,” by Arbel Nissan (December 2016)

2. “DC Analysis of PDN: Essential for the Digital Designer,” by Jeff Loyer (March 2016)

1. “Via-in-Pad Design Considerations for Bottom Terminated Components on PCB Assemblies,” by Matt Kelly, Mark Jeanson and Mitch Ferrill (March 2016)

Thanks, as always, for reading!

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association ( He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow