“Rebuilding the US packaging industry would not only insulate chip companies and their customers from political risk, it could also help them break free of the long cycles involved in creating new chips, said Tony Levi, a professor of electrical and computer engineering at the University of Southern California.”
Reading that, I can’t help but think of Endicott Interconnect Technology and what might have been.
It must have been 15 years ago when I toured EI, the one-time IBM campus where bare board fabrication, assembly and chip packaging all took place. So self-contained was the operation, in fact, they had their own laminate treater.
EI was where the HyperBGA and CoreEZ high-speed flip-chip BGA packages were invented, as well as custom laminates for semiconductor packages. The engineering talent was second to none. They really could do it all.
What they never mastered, however, was the right scale. Agreements to license their products went nowhere. The layout complicated process flow: I remember having to duck to avoid banging my head as I would my way through the partially subterranean assembly facility. Dwindling revenues coupled with the high cost of doing business in New York ultimately scuttled the company, and the assets were sold to TTM in 2019.
With today’s emphasis from President Biden on down on rebuilding the US semiconductor industry, however, one can’t help but wonder whether EI was the right idea, just 20 years ahead of its time.