Why ‘Green Mold’ Might Be Bad for You

Researchers at IMEC have found that quartz-filled compounds used in place of halogen flame retardants in plastic packages lowered the CTE, and the subsequent mismatch in thermal expansion between the package and board is causing solder joint fatigue cracking, researchers found. The investigators are calling this failure mode “Cu lead fatigue fracture.”

Here’s the link: http://circuitsassembly.com/cms/news/12195-paper-halogen-free-packages-reveal-new-failure-mode

This entry was posted in Hot Wires and tagged , , by Mike. Bookmark the permalink.

About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow