Sharper Focus for New Year

Happy new year! Hope this one’s a sight better than the last.

What’s new at Circuits Assembly in 2010? For starters, we plan to double-down on our technology coverage. Poll after poll of our readers shows we are at our best when we focus on the tech side. Ergo, rather than pushing the same, watered-down press releases you can find anywhere, we are ramping our coverage of new (and improved) processes for assembling and soldering circuit boards, while trying to pin down the issues behind the same.

We also are adding more analysts to discuss the technology’s pros and cons, giving you better insight without having to hop on a plane to attend a pricey tech conference.

We are looking forward to 2010, which we will be a bounce-back year for electronics manufacturing. I don’t predict a return to double-digit growth, but I think gains in the high single-digits are very achievable.

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association ( He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow