Solder Defects Causes and Cures Webinar

If you missed the SMTA International preshow webinar supported by CIRCUITS ASSEMBLY you can view it online here.

Printing solder paste or other conductive material requires zero defects printing if a high first-pass yield is to be achieved when using fine-pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?

Correct printer setup, good stencil design and manufacture plus consistent printing materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three-dimensional inspections are required in other AOI applications like solder joint analysis. There are common process defects during printing and reflow, Willis says, and the webinar shows causes and cures to help yield improvement.

The webinar is presented by Bob Willis and covers:

  • Solder paste inspection standards
  • Soldering yield impact with poor printing
  • Common solder paste defects
  • Impact on reliability based on paste thickness
  • Solder joint inspection defects
  • Common process defects causes and cures

Results of survey of 98 engineers from last week’s webinar on process defects.

ProcessDefects
Print Defects
Inspection Location

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About Mike

Mike Buetow is editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He is also vice president and editorial director of UP Media Group, for which he oversees all editorial and production aspects. He has more than 20 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow