The Top 10 in PCD&F

Yesterday, we reported the top 10 best-read articles published by CIRCUITS ASSEMBLY in 2015. Today we list the best-read articles from PCD&F.

The list includes features that were published for the first time in calendar 2015. Rankings are based on web site hits, and do not include — for obvious reasons — the number of reads in the print version of the magazine.

1. “Embedded Passive Technology Materials, Design and Process,” by Hikmat Chammas
2. “Beyond the Vault: The Evolution of PCB Design Archiving,” by John McMillan.
3. “01005: Size Does Matter,” by Arbel Nissan.
4. “Trace Current/Temperature Relationships,” by Douglas G. Brooks, Ph.D. and Johannes Adam, Ph.D.
5. “Microsectioning of Laminates,” by Karin Rudman Prieto, Ph.D., Peg Conn, Lizabeth Lagos and Charles Lehmann.
6. “The Changing Face of the Hardware Design Engineer,” by Steve Hughes.
7. “Refining Lean NPI at Optimum Design Associates,” by Randy Holt.
8. “The 3 Challenges Facing the Future of PCB Design,” by David Wiens.
9. “How Hot Is My Via? (Cooler Than You Think!),” by Douglas G. Brooks, Ph.D. and Johannes Adam, Ph.D.
10. “In Search of Greater Tolerance,” by Peter Bigelow.

There was a definite advantage for articles that were published near the beginning of the year. If we adjust for timing, a feature on field solvers authored by Dr. Eric Bogatin and published just last month more than likely would have made the top 10. And although not reflected here, there was tremendous and perhaps disproportionate interest in flex circuits, given the smaller audience involved to-date in flex, with pieces by Mark Finstad (“Designing Flex Circuits For Wearable Electronics“) and Ben Jordan (“Designing a Successful High-Speed Rigid-Flex PCB“) just missing the top 10.

As always, we are grateful for our loyal readers and the many authors who contribute their expertise each month.

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About Mike

Mike Buetow is president of the Printed Circuit Engineering Association ( He previously was editor-in-chief of Circuits Assembly magazine, the leading publication for electronics manufacturing, and PCD&F, the leading publication for printed circuit design and fabrication. He spent 21 years as vice president and editorial director of UP Media Group, for which he oversaw all editorial and production aspects. He has more than 30 years' experience in the electronics industry, including six years at IPC, an electronics trade association, at which he was a technical projects manager and communications director. He has also held editorial positions at SMT Magazine, community newspapers and in book publishing. He is a graduate of the University of Illinois. Follow Mike on Twitter: @mikebuetow