A few days ago, I wrote about HASL PC board surfaces, explaining that it’s not an appropriate choice for small parts.
Look at the same PCB image I used the other day. You might not recognize it because before it was on the right, and today it’s on the left. Getting past the fact that I just insulted everyone’s intelligence, there is something else about this board that we don’t recommend.
I’ll give you 30 seconds to figure it out. I don’t have a stopwatch, so the 30 seconds is on the honor system.
This is a land for a 0.5mm pitch BGA. As I wrote before, HASL is not the right choice for BGAs, especially for those of the smaller pitch variety. The other problem with this board is in the pad layout.
These are solder mask defined (SMD) pads – the solder mask covers the outer part of the pad, so the solderable copper surface is determined by the size of the opening in solder mask, not by the area of the copper pad.
For BGAs 0.5 mm pitch and larger, we (and pretty much everyone else) recommend non-solder mask defined (NSMD). With a NSMD pad, the solder mask opening is larger than the pad. This leaves more copper area to adhere to, including the sides of the copper pad. It tends to be much more reliable.
The image to the right illustrates the difference.
The left-most pad in the image illustrates an SMD pad, while on the right is an NSMD pad. The NSMD pad leaves a lot more surface area of the copper pad for the solder ball to grip on, including the sides.
BGAs with 0.4mm pitches might need either SMD or NSMD pads, depending on a number of circumstances. Read this blog information for a bit more on 0.4mm. When in doubt, look in the back of the datasheet.
Question for physicists and mathematicians:
Should the last recursion in the Mandelbrot set land on Plank’s constant?
Show your work.